Automatic assembly of Printed Circuit Boards (PCB) in mechanical equipment requires that PCBs do not get strained beyond specifications.
Use of smaller and smaller electronic components on the PCBs and more and more layers of PCBs call for even more stringent control of assembly parameters to ensure the PCBs are not damaged during assembly. One of the effective ways to ensure the survivability of the PCBs during assembly is to instrument the PCBs with strain gages and perform multiple trial runs to control the process parameters.
Furthermore, many computer and component manufacturers specify strain tests to be done according to JEDEC-9704A, which requires very specific strain measurements, strain gage placements as well as principal strain calculations with respect to strain rates and principal angles.
Invicom is helping assembly process integrators and manufacturers to measure and document PCB strains during assembly for the machine set up and calibration.
For such measurements it is generally required to use the strain rosettes owing to undetermined direction of strain as well as changes in principal strain direction during assembly. Principal strains in orthogonal directions are calculated with respect to the principal angle and rate of change of strain (Strain rates).
Our in house measurement systems have built-in evaluation for principal strains, principal angles, strain rates and von-Mises stress levels on the fly during the measurement and results can be obtained immediately for pass/fail criteria, as well as for tuning of actuator. Our measurement procedures and test reports comply to JEDEC-9704A, and able to meet any additional customer specific criteria and calculations.
Our state of the art synchronous multi-channel measurement systems are annually calibrated to traceable international standard laboratories and able to cater for hundreds of measurement channels at any time.
Here are some of the gaging examples of PCBA for assembly.